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- Advanced Electronic Packages:
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HCC Aegis has produced a series of lightweight, hermetic, high efficiency and low thermal resistance packages to satisfy the ever changing needs of the microelectronics industry.
Features:
- Offers low profile, multilayer, co-fired, co-planar feedthrus, in conjunction with a highly efficient thermal management base.
- Design for either high frequency impedance match, DC circuits or a combination of both.
- Resistance or laser weldable and compatible with existing sealing systems.
- Base materials can be designed to match substrate TCE, reducing induced thermal stress over a wide range of operating temperatures.
Application Include:
- Navigation equipment (GPS)
- Weapons Systems
- Military Satellites and Aircraft
- Radar Systems
- Test and Measurement Equipment (RF Frequency)
- Engine Controllers
- Medical Equipment
- Communications
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Typical Material Combinations
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Material
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Base Conductivity W/m ～K
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CTE X 10-6/～C
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Density LBS/in 3
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Ring Frame Material
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| ASTM F-15 Alloy |
14 |
4.9 |
.302 |
ASTM F-15 Alloy |
| W/Cu |
175 - 205 |
6.5 - 8.3 |
.535 - .611 |
Fe Ni Alloy |
| Mo/Cu |
165 - 185 |
6.5 - 7.7 |
.357 - .361 |
Fe Ni Alloy |
| Al/SiC |
160 |
6.5 - 8.5 |
.107 - .110 |
Contact the factory |
| Al 2 O 3 |
25 |
6.9 |
.143 |
Contact the factory |
| GaAs |
44 |
6.5 |
.193 |
Contact the factory |
| AIN |
170 |
4.6 |
.120 |
Contact the factory |
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