环宇企业 (Universal Enterprise) - 半导体裸芯片,大圆片,封装材料,管壳,盖板,裸芯片贴片机/粘片机/固晶机,共晶贴片机,粘胶贴片机,晶粒分拣机/挑粒机,测试仪,湿法清洗台,亚洲/中国分销商、供应商。

环宇企业
搜索:
English

From Universal Enterprise

封装材料

气密封装

Power Surface Mount Packages:

A true Power Surface Mount Package. The HCC Aegis patented design is a very low thermal resistance, high efficiency, small, hermetic, surface mount package. These packages are ideally suited to house power MOSFETs, single and center-tap power Shottky rectifiers, as well as adjustable and fixed voltage regulators. This unique design brings together highly efficient thermal management materials in a very low profile, resistance weldable package. Available in standard and custom configurations.







电子邮箱:sales@ue.com.hk | 电话: +852-2771 1286 | 传真: +852-2771 1025 | 在线反馈表单
版权所有 (C) 1992-2007 环宇企业
网页设计、技术支持由Immedia Solutions提供。
User Login