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半导体词汇表 - L


  • L-band

The group of radio frequencies extending from 390 MHz to 1550 MHz. The GPS carrier fre-quencies (1227.6 MHz and 1575.42 MHz) are in the L-band.

  • Ladder Principle

A principle used to order waste management methods in terms of their environmental acceptability or friendliness. The most environmentally acceptable waste management method is to reduce the amount of waste being produced (prevention), followed by reuse of the waste or components of the waste (reuse, reclaim, recycle, recovery), followed by reuse of the energy content of the waste through burning with heat recovery, followed by incineration or other destruction techniques, with landfilling as the least environmentally acceptable waste management method. Also known as the waste management hierarchy.

  • LAD dose

Lowest Acceptable Daily dose

  • LAER

Lowest Achievable Emission Rate

  • LAN

Local Area Network

  • Landfilling

The controlled deposition in or on the ground of wastes. Landfills are more sophisticated versions of waste dumps, places where historically wastes were just dumped in or on the ground. Current landfill design generally requires use of impermeable liners and leachate and biogas collection systems, all landfills must be authorized and their authorization requires the use of strict management practices designed to reduce the impact of landfills on the environment, finally when they are full their owners are generally required to close them in a manner which will ensure that the wastes they contain will continue to not impact the environment. Landfills are currently mostly used for disposing of urban wastes, although they are also used for industrial solid wastes which are not easily burned or otherwise destroyed. Several countries, including France and Italy, are moving towards the elimination of all landfills unless absolutely required.

  • Lapping

Operation to reduce thickness of silicon wafer after fabrication steps. This is necessary because initially the silicon wafer must be thick to withstand the high temperature processing steps, but it must be reduced to achieve the desired electrical characteristics.

  • Laptop

Portable personal computer small enough to hold in your lap.

  • LAPUT

Light-Activated Programmable Uni-junction Transistor

  • LAS

Linear Alkyl Sulphonate

  • LASER

Light Amplification by the Stimulated Emission of Radiation

  • L.A.T.C.H

A cascade TQM training program, divided into the following stages: Learn Apply Teach CHeck

  • Latch up

1) In an electrical circuit this refers to when the circuit is conducting and hold this state. 2) In CMOS this refers to the parasitic conduction that occurs when the parasitic n-p-n and p-n-p transistors get turned on.

  • Laterial PNP transistor

An integrated transistor that is made in such a way that the transistor action is laterally across the surface of the diffusions rather than vertically through the N and P diffusions.

  • Layout

The operation of arranging the elements of an integrated circuit design and interconnecting them. The layout designer starts with an electrical diagram of the circuit to be created and delivers the finished layout in the form of a PG tape.

  • LBA

Laser Beam Analysis

  • LBGA

Low-profile Fine pitch Ball Grid Array Low-profile Ball Grid Array with pitch less than 1.0mm.

  • LC

1) Liquid Chromathography 2) Lethal Concentration

  • LC50

Lethal Concentration - 50 percent (the concentration that kills 50 percent of the test organisms)

  • LCC

Leadless Chip Carrier

  • LCA

Life Cycle Assessment

  • LCC

Leadless Chip Carrier

  • LCD

1) Liquid Crystal Display A digital display mechanism made up of character-forming segments of a liquid crystal material sandwiched between polarising and reflecting pieces of glass. 2) Light Changing Diode

  • LCDC

Low Cost Digital Camera

  • LCI

Life Cycle Inventory

  • LCLO

Lethal concentration, low (the lowest concentration that kills test organisms)

  • LCM

1) Life Cycle Management 2) Least/Lowest Common Multiple

  • LD

1) Latest Date 2) Lethal Dose 3) Line Driver

  • LD50

Lethal Dose - 50 percent

  • LDC

London Dumping Convention

  • LDLO

Lethal Dose, low (the lowest dosage that kills test organisms)

  • LDMOS

Lateral Double-diffused Metal Oxide Silicon

  • LDP

LLaser Disk Player

  • LDPE

Low density polyethylene

  • Leachate

Water that has migrated through and escaped from a landfill site. The water contains dissolved and suspended material extracted from the waste, some of which can be toxic. Unless it is collected, leachate will eventually contaminate the underlying aquifer.

  • Lead

One of the external connections of an integrated circuit or transistor

  • Lead (Pb)

One of a group of metallic elements classified as heavy metals. It is a poor conductor of electricity and heat. It is a very soft and malleable metal, and was historically used to make water pipes. In old houses which still have such piping, drinking water can be contaminated with lead. More modern drinking water pipes can also be contaminated with lead if lead-based soldering material has been used. It forms both inorganic and organic compounds. Organic lead compounds are used as anti-knocking agents in leaded gasoline, which has led to a considerable dispersion of lead in city streets and land along roads. The latter has led to widespread, low-level contamination of foods. A common use of inorganic lead compounds has been as a pigment in paints, so many old houses and buildings have leaded paint. Lead is extremely toxic to humans as well as to other living beings. Currently, it is the only non-carcinogenic substance where toxicologists believe there is no threshold below which it has no effects. Overexposure to this metal can cause damage to circulatory, digestive, and central nervous systems. Children less than six years old are considered the most susceptible. Atmospheric levels have dropped sharply in countries where leaded gasoline has been phased out.

  • Lead forming

The operation of bending the leads of an integrated circuit to the desired shape.

  • Lead frame

In the packaging of integrated circuits and transistors, the leadframe is the metal frame onto which a die is attached and bonded. Parts of the leadframe become the external connections of the circuit.

  • LED

1) Light Emitting Diode A compound semiconductor device that emits light whenever current passes through it. 2) Luminescent Electro Diode

  • LEDC

Low End Digital Camera

  • LEL

Lower Explosive Limit

  • LEO

Low Earth Orbit Satellite

  • LEP

Light Emitting Polymer Displays

  • LFBGA

Low-profile Ball Grid Array less than 1.7 mm total height.

  • LFL

Lower Flammable Limit

  • LGA

Land Grid Array

  • LI

Liquid Photo Imageable Type of high density solder mask.

  • Library

Group of computing data representing a function or a component, in the form of symbols, models, diagrams and layout, used by CAD systems for designing integrated circuits.

  • LIC

Linear Integrated Circuit

  • Life Cycle Analysis (LCA)

A methodology used to evaluate and quantify all the environmental impacts which a product can have "from cradle to grave", i.e. during its manufacture, during its distribution to the end-users, during use and finally when disposed of. More extended LCA also evaluate and quantify all the environmental impacts from the raw materials used in the product back to the original raw materials (the ores which were mined, the crude oil which was extracted, etc.).

  • LIFO

Last In, First Out

  • LIGBT

Lateral Insulated-gate Bipolar Transistor

  • Line width

Width of an opaque line. Usually refers to a dimension on a mask or a feature on an IC.

  • Linear device

An amplifying-type (or analog) device, as opposed to digital device.

  • Linear circuit

A circuit whose output is an amplified version of its input or whose output is a predetermined variation of its input.

  • Lithography

The transfer of a pattern or image from one medium to another, as from a mask to a wafer. If light is used to effect the transfer, the term, "photolithography" applies. "Microlithography" refers to the process as applied to images with features in the submicron range.

  • Livonia

Small town on outskirts of Detroit (USA). Location of ST's North American Automotive Business Unit.

  • LLRW

Low Level Radioactive Waste

  • LMFBR

Liquid-Metal Fast Breeder Reactor

  • LMI

Link Management Processing

  • LNBP

Low Noise Block Set-top box application

  • LNG

Liquefied Natural Gas

  • LOA

Letter of Agreement

  • LOAEL

Lowest Observed Adverse Effect Level

  • Logic circuits

An interconnection of individual, combinational and sequential logic circuits perform control and computation using digital techniques.

  • Logic family

Each "family" of IC is manufactured with one particular technology. Logic families cover a wide range of devices providing anything from basic Boolean logic functions to highly complex functional combinations capable of division, addition, etc... Some devices contain a set of elementary logic sub-devices which can be connected by means of electrical programming to form quite complex customized circuits. These devices are used in simple electronic systems and as "glue" between the microprocessor and memory chips in more complex systems.

  • Logic Gate

A circuit that accepts one or more than one input and always produces a single predictable output.

  • LOI

Letter of Intent

  • LORAN

LOng RAnge Navigation

  • LP

1) Low Power 2) Low Pass

  • LPC

Linear Predictive Coding Low Pin Count

  • LPCVD

Low Pressure Chemical Vapor Deposition A chemical vapor deposition process that takes place at moderate temperatures.

  • LPG

Liquefied Petroleum Gas

  • LPM

Lines Per Minute

  • LPR

Linear Post Regulatorn

  • LPSRAM

Low Power Random Access Memory

  • LPT

Line PrinTer

  • LPTTL

Low Power Transistor-Transistor Logic

  • LRR

Lot Rejection Rate % of lots rejected at final QC1 or incoming inspection relative to total lots tested.

  • LRU

Least Recent Used

  • LRVS

Linear Voltage Ramp Stress

  • LSA

1) Logistic Support Analysis The selective application of scientific and engineering efforts undertaken during the acquisition process to assist in complying with supportability and other ILS (Integrated Logistic Support) objectives. 2) Logic States Analyser

  • LSB

Least Significant Bit

  • LSI

Large Scale Integration An IC containing 100-1000 circuits.

  • LSL

Lower Statistical Limit

  • LSTTL

Low-power Schottky TTL The power dissipation of LSTTL is typically one-fifth that of conventional TTL.

  • L/T

Longitudinal/transversal (balance)

  • LT

Lead Time

  • LTD

1) Long Term Disability 2) Limited

  • LT Debt

Long Term Debt

  • LTPD

Lot Tolerance Percent Defectives

  • LV

Low Voltage

  • LVD

Low Voltage Detector

  • LVDS

Low Voltage Differential Signal

  • LVS

Layout Versus Schematic Software for checking conformity of the layout with respect to the circuit electrical diagram.

  • LUST

Leaking Underground Storage Tank

  • LW

Long Wave

  • LWR

Light-Water Reactor



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