HCC Aegis has produced a series of lightweight, hermetic, high efficiency and low thermal resistance packages to satisfy the ever changing needs of the microelectronics industry.

Features:

• Offers low profile, multilayer, co-fired, co-planar feedthrus, in conjunction with a highly efficient thermal management base.
• Design for either high frequency impedance match, DC circuits or a combination of both.
• Resistance or laser weldable and compatible with existing sealing systems.
• Base materials can be designed to match substrate TCE, reducing induced thermal stress over a wide range of operating temperatures.

Application Include:

• Navigation equipment (GPS)
• Weapons Systems
• Military Satellites and Aircraft
• Radar Systems
• Test and Measurement Equipment (RF Frequency)
• Engine Controllers
• Medical Equipment
• Communications