HCC Aegis designs and manufactures an extensive range of Hermetic Opto-electronic packages.
High reliability, hermeticall sealed product in many configurations including standards——Flatpacks(butterfly style), Plug-ins(bathtub style), and plat-forms(dual-in-line style), and many other sophisticated metal composite packages. These packages are developed to hermetically encapsulate laser diode transmitter and receiver assemblies and other Opto-electronic circuits.
Products can be manufactured with matched glass-to metal seals or stripline ceramic inserts, utilizing materials ranging from ASTM F-15 to advanced thermal management materials to enhance and optimize device performance.
High quality products are made in conformance with and certified being compliant to MIL-PRF-38534.
Typical Opto Material Combinations
|
|
Base Material
|
Base Conductivity W/m ~K
|
CTE X 10-6/~C
|
Density LBS/in 3
|
Ring Frame Material
|
| ASTM F-15 |
14 |
4.9 |
.302 |
ASTM F-15 |
| W/Cu |
175 - 205 |
6.5 - 8.3 |
.535 - .611 |
Fe Ni Alloy |
| Mo/Cu |
165 - 185 |
6.5 - 7.7 |
.357 - .361 |
Fe Ni Alloy |
| Mo |
140 |
6.0 |
.408 |
ASTM F-15 |
| Al/SiC |
160 |
6.5 - 8.5 |
.107 - .110 |
Contact the factory |
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