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MP300 Automatic Die Handling and Sorting System
Award winning system specifically engineered to support multi-project type wafers. Automatically die sorts from wafer maps, including pizza mask and places into varies medium such as waffle pak or GelPak™.
The MP300 system is highly flexible and easy to set up. The system is ideal for high mix, medium volume production or prototyping. Platform handles from 3 inch (150mm) to 12 inch (300mm) wafers. Designed for quick change over of new die sizes and output medium with our pre-leveled output fixtures, which eliminates unnecessary downtime.
Our MP300 pick and place system has superior ability to handle thin fragile devices without damage, based on our custom design eject mechanism. The patented non-surface contact (NSC) edge grippers allow pick up of 2 mil thick GaAs die without damage. System picks devices at programmable heights and speeds with either NSC edge grippers or vacuum.
Whether you are seeking a system for handling medium high mix volume (2000 UPH), extremely thin fragile die, or pizza mask type wafers, the Royce Instruments MP300 die system is here to support your needs.
For more information and applications specific details, please contact our sales department.
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