From Universal Enterprise

Packages Packages Overview Ceramic Packages Metal Packages Plastic Packages Hermetic Packages Lids and Covers Enquiry

Ceramic Packages: CPGA (Ceramic Pin Grid Array) Cerdip Package Cerquad (Hard Glass Packages) Hybrid (Module Packages) LCC (Leadless Chip Carrier) LDCC (Leaded Chip Carriers and Flat Pack) Side-brazed Dip (Dual In-Line Ceramic Package) SOIC (Small Outline Integrated Circuit Packages)