With Watlow F4 Series programmable temperature controller

The EDB80-P Precision Die Bonder is designed for bonding delicate GaAs laser devices and similar materials, to a high degree of placement accuracy. A selection of vacuum pick-up tools, collets and custom tools can be supplied to suit a wide range of die and preform sizes.

DIE HANDLING

The bonding arm is mounted on precision pre-loaded bearings, and can be counter-balanced for bond forces of between 8 and 250 grams. The sensitive operator controlled Z lever coupled with light loading, eliminates die damage during production. A two position waffle/gel pack presentation table is supplied as standard. The die pick-up tool can be finely rotated for accurate die positioning prior to final placement.

PRECISION PLACEMENT

A placement accuracy of 5 microns or better can be achieved using the high ratio fine X,Y manipulator, motor driven rotary bond head and workholder. A stop-to-stop 90 degrees movement of the heated workholder provides full flexibility for die positioning.

TEMPERATURE CONTROL SYSTEM

A Watlow F4 series controller is incorporated as standard for rapid, precise heating and cooling temperature profiles. Multiple program storage provides the ability to store individual programs for various types of heated workholders

WORKHOLDER

A range of heated workholders is available to cater for a variety of submounts, TO Headers and C-mount type packages. , catering for flat sub-mounts, TO Headers, and C- Mount type packages. A range of interchangeable workholders are available to suit most applications. The submount or package is vacuum clamped to a graphite strip which acts as a heating element, and cover gas is supplied to eliminate oxidation during the bonding of the die.

OPTICS

For maximum die placement accuracy, good quality optics and lighting is essential. The Leica MZ7.5 Stereo microscope with ring illumination is recommended. However, other microscopes are also available upon request.