| W/B |
wire bonding |
| WAN |
wide area network |
| WB |
weak base |
| WBS |
work breakdown structure |
| WBSEM |
Wire Bonder Specific Equipment Model |
| WDS |
wavelength-dispersive spectrometry of X-rays |
| WDX |
wavelength-dispersive X-ray |
| WDXA |
wavelength-dispersive X-ray analysis |
| WEC |
wafer environment control |
| WFT |
wafer fabrication template |
| WIB |
within-batch |
| WIP |
work in process; work in progress |
| WIW |
within-wafer |
| WIWNU |
within-wafer non-uniformity |
| WLBI |
wafer-level burn-in |
| WLP |
wafer-level package |
| WLT |
wafer-level test |
| WNP |
waste neutralization plant |
| WPC |
wafer process chamber |
| wph |
wafers per hour |
| WSI |
wafer-scale integration |
| WTC |
wafer transfer chamber |
| WTW |
wafer to wafer |
| WTWNU |
wafer-to-wafer non-uniformity |
|
