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What's New! Isolink Inc. Universal Bond Tester MiniBond FC300 Flip Chip Die Bonder Wet Benches Search Die Catalog

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PRODUCT HIGHLIGHTS:   NEWS AND ANNOUCEMENTS:   Quad Flat No-Lead Packages Open Cavity Plastic QFP Packages SOIC (Small Outline IC) & SSOP (Shrink Small Outline Packages) Royce Instruments Die Handlers Royce Instruments Bonder Testers Cammax Products HCC Products Hi-Rel Lids - Hi-Rel Products Altera FPGA and CPLD products in die form 　 ISSI Bare Die for Multi-Chip-Module and Hybrid circuits Universal Enterprise/Shenzhen Cheer Electronics Co., LTD has been Isolink Inc.'s Agent Universal Enterprise/Shenzhen Cheer Electronics Co., LTD has been Royce Instruments's Agent in China Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been HCC’s exclusive Agent in China/HongKong/Taiwan since 15st May 2007 Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been Cammax’s exclusive Agent in China since 1st January 1999 Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been Hi-Rel’s exclusive Agent in Asia/China since 1st August 2006 Universal Enterprise to introduce new Wet Bench product lines