Resource > Bare Die > How much money will it save me ?

The following assumptions have been made.

1. PCB costed @ $40 per square decimetre

2. All costs based on volume of 1KK components3. Cost model will vary slightly for higher or lower Leaded devices, the total costs per package type will still be relatively similar

Feel free to contact us and we will be happy to investigate a cost model based on your particular circumstances.

In Summary

the cost benefits of using bare die assembly can be broken down as follows:

• Higher levels of integration
• Reduced Substrate size/cost
• Reduced Assembly / manufacturing process cost
• Faster Time to market
• Better Product value
• More features per bare die area and weight reduction

How to Set up the Bare Die Assembly Line - Key Points

Firstly, if in volume, can the product be manufactured cheaper by using bare die assembly? See matrix above Secondly are there other technical reasons to use bare die? Does it need to be smaller, lighter, dissipate more heat, or need, on certain devices, to work faster?

The Customer needs to decide on which technology is best suited for the production of the circuit. For example, for small volumes, or a wider temperature range, it is best to consider Chip on Board. For larger volumes, it is best to consider Flip Chip. There are three main options - gold stud bumps, micro posts, solder bumps and a range of die attachment methods. We at Die Technology can help you determine the most appropriate method either by correspondence or a personal visit.

It is often better to run with one option for prototypes and another for higher volumes. A product could start out as Chip on Board then, using the same equipment set, change to micropost or flip chip when the volume increases. At all stages the customer could either opt to do the work themselves, sub-contract the manufacture, or use a combination of both.

A final factor the customer needs to be aware of the upcoming Lead Free solder initiatives and how this could impact their assembly process.

To setup the assembly line Die Technology Ltd will train your company to handle bare die, inspect, assemble, and bond at any volume. Also, we can assist in the writing, or vetting, of detail specifications for bare die purchase and application notes. We have the expertise to define the whole process form start to finish and can provide full consultation and training on the equipment to needed for the application.

Your costs for this service - If we assist you by correspondence then we will not charge you, providing an agreement is made to place all the related die business with us. For off-site consultation activities, the charge is $1500 per day plus travel and expenses. These fees can also be amortised for large die orders placed with us.

Success Stories

Mobile phones, Laptop flexes and RFID applications are probably the best examples. Motorola's latest phone range, by using Flip Chip die, saves over fifteen percent in component costs and twenty percent of assembly costs. Sun Rise Technology in China manufacture colour screens boards for a similar spec mobile phone. The basic model used a black and white screen running off a Phillips bare die LCD Driver, which required 720 bond pads and this was attached using standard chip on board technology. The new colour version required a LCD Driver die with 940 bonds, which could not be accommodated on the periphery of the chip without significantly increasing the die size and board real-estate. By setting up a gold-flip chip assembly, we were able to place pads within the centre of the chip. This not only reduced the cost of the device but also saved Eighty Percent of the assembly time due to the chip requiring only placement on a strip of foil without need for bonding. On 30 million screens per year the saving was "Very significant!".