Hybrid Package - Multi-Chip Module (MCM)

The Hybrid Package(MCM) is a high density IC packaging.The high speed performance and thermal advantages of the MCM package provide the platform for increased enhancement for mixed semiconductor technologies such as Anolog/ Digital, bipolar/CMOS,ASIC,DSP,etc. in a single IC package. This MCM technology allows existing and presently available ICs to be designed in a single,space-saving, low-cost system package.The MCM may consist of a single construction or be made up of sub-modules. Each module usually contains a compartment to house the hermetically packaged hybrids and discrete passive component parts such as transformers, axle-lead resistors, etc.Hybrid package is a special carrier of hybrid microcircuits and other components interconnected as one unit, or as a component of an electronic subsystem.

These packages come in a wide variety of package configurations: Ceramic, Metal, DIP style and Flat Pack.

Features:

• Improved thermal performance
• Superior electrical performance
• Very low design and tooling cost
• Flexible circuit designs
• Versatile substrate routing
• Choice of package body size