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MA12 SEMI-AUTOMATIC DIE BONDER
The MA12 has been designed with total flexibility in mind, and is suitable for most applications from batch work assembly to full production requirements. This modular system can handle wafer sizes of up to 8” in diameter, and has a placement capacity of up to 152mm square. A precision overhead gantry unit is incorporated for transporting the bonding head, colour camera and adhesive syringe dispenser during machine operation. The MA12 in standard configuration can achieve a placement accuracy of +/-25 microns with a dry cycle time of up to 2000 units per hour. An embedded Windows based PC controller is utilized for most operating functions and set up procedures.
DIE HANDLING
The die pickup tool-holder is mounted on a motorised vertical slide. Vacuum pickup tools are easily interchanged to suit different applications, and a die pickup vacuum sensor is fitted as standard.
DIE PRESENTATION
Modular construction allows easy changeover from wafer to waffle or gel packs. Ring or frame mounted wafers of up to 8” can be fitted to a die ejection platform. A waffle/gel pack stage can be retrofitted for presenting up to 8 waffle/gel packs.
DISPENSING
An adhesive syringe can be fitted for positive pressure dispensing. Alternatively, a printing unit and head is available for stamp printing of adhesive.
PLACEMENT CAPACITY
A working area of up to 152mm x 152mm is incorporated for both dispensing applications and bonding of dice. Heated and non heated work-holders are available to suit most types of packages.
CAMERA SYSTEM
A colour camera with TFT flatscreen monitor and ring illuminator is supplied as standard.
- Email: sales@ue.com.hk
- China: Tel: (+86)0755-82663600 | Fax: (+86)0755-82663760
- Hong Kong and other area: Tel: (+852)2771-1286 | Fax: (+852)2771-1025
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