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Semiconductor Equipments

Die Bonders

MiniBond:


MiniBond

Introducing the NEW MiniBond, one of our latest additions to the Cammax Precima range of Die Bonders.


This compact low cost unit is ideally suited to development projects and batch work assembly.


A glass table supports both die presentation and substrate workholders, whilst a precision Z slide ensures smooth operation during dispensing and die handling.


Interchangeable heads are supplied for die handling and dispensing operations.


A variety of pickup tools and dispense nozzles is available to suit most applications.


A die placement accuracy is possible to +/- 50 microns


A workholder pedestal is supplied to suit flat substrates of up to 50mm square


Other heated and non heated workholders can be supplied upon request.


A colour camera with TFT flat screen TV/monitor is supplied as standard. An adjustable on screen target box is incorporated for die alignment and placement positions.




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