Packages > Plastic Packages > Open Cavity Plastic QFP Packages:

Open Cavity Plastic QFP Packages

SEMPAC's line of QFP products (Quad Flat Pack) are offered in various pre-molded Open Cavity package configurations. These QFP off-the-shelf packages are constructed of semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. These packages can be sealed with ceramic or plastic lids, or with an epoxy glob top. Open cavity plastic packages have the same mechanical and electrical characteristics as their transfer molded counterparts that are typically assembled offshore, and are fully compatible with the same test fixtures. They can all be assembled using standard assembly procedures.Please refer to the part list for a solution to your requirements.

SEMPAC's QFP packages are gold plated to military standards to insure reliable wire bonds and strong durable die adhesion. All QFP packages meet JEDEC standard outlines and footprints and are designed with tie-bars to eliminate co-planarity issues, at all -4- corners. For applications that require higher frequency applications, SEMPAC offers a “heat enhanced” version on all our QFP packages.

Heat Enhanced QFP product:

Optional surface finishes are also available which include; Nickel Palladium ( Ni/Pd ) and Nickel, Palladium, Gold ( Ni, Pd, Au ) both of which are proven surface finishes for successful wire bonding.

If you have a specific application that requires customization, SEMPAC offers the lowest cycle time and NRE’s (non-recurring engineering) cost when designing a customer’s package.

Features

• Great Quickturn Assembly Solution Can be used for R&D or small production builds.
• Open-Pak Packages have the same footprint as production plastic packages.
• Newly manufactured material. These parts are not previously assembled rejects or “cleaned out” dummy packages.
• Easy to seal using ceramic or plastic lids with epoxy perform or with epoxy glob top.

Part List