Packages > Plastic Packages > SOIC & SSOP:

SOIC (Small Outline IC) & SSOP (Shrink Small Outline Packages)

SEMPAC's open-cavity packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attached pad and lead frame. Open-Pak package can be sealed with ceramic or plastic lids, or with an epoxy glob top. They have the same mechanical and electrical characteristics as their transfer molded counterparts that are typically assembled offshore, and are fully compatible with the same test fixtures.

All SEMPAC's products are all newly manufactured and are not cleaned out dummy or previously rejected parts. They can all be assembled using standard assembly procedures.

SOIC’s (Small Outline IC’s) & SSOP’s (Shrink Small Outline Packages ) are offered in both a “Heat Enhanced” version that enables heat dissipation at high frequencies and standard surface mount footprints. These “solutions” feature external leads, bonding fingers and die pads that are gold plated to military standards. The leads are gull-wing formed with varying pin counts.

Heat Enhanced SOIC product:

SOIC’s & SSOP’s are also available in the Nickel Palladium (Ni/Pd) and Nickel, Palladium, Gold (Ni/Pd/Au) surface finishes. If you are looking to accelerate the process of introducing new products such as cell phones, PDA’s and digital camera’s, to name but a few, to the market faster then SEMPAC solutions for packages are tailored fit for these applications.

If you have a specific application that requires customization, SEMPAC offers the lowest cycle time and NRE’s (non-recurring engineering) cost when designing a customer’s package.

Feature

• Great Quickturn Assembly Solution Can be used for R&D or small production builds.
• Open-Pak Packages have the same footprint as production plastic packages.
• Newly manufactured material. These parts are not previously assembled rejects or “cleaned out” dummy packages.
• Easy to seal using ceramic or plastic lids with epoxy perform or with epoxy glob top.

Part List: