Packages - Universal Enterprise: Semiconductor Bare Die, Wafer, Packaging Materials, Lids and Covers, Die Bonders, Die Handlers, Bonder Testers and Wet Benches distributor in China/Asia.

From Universal Enterprise

Packages

Packages Overview
Ceramic Packages
Metal Packages
Plastic Packages
Hermetic Packages
Lids and Covers
Enquiry

Ceramic Packages:

CPGA (Ceramic Pin Grid Array)
Cerdip Package
Cerquad (Hard Glass Packages)
Hybrid (Module Packages)
LCC (Leadless Chip Carrier)
LDCC (Leaded Chip Carriers and Flat Pack)
Side-brazed Dip (Dual In-Line Ceramic Package)
SOIC (Small Outline Integrated Circuit Packages)

Metal Packages:

Transistor Outlines - TO Headers and Cans

Plastic Packages:

Unversal Enterprise/Shenzhen Cheer Electronics Co., LTD has been SEMPAC Agent in Asia.

We sell SEMPAC Products:

Quad Flat No-Lead Packages
Open Cavity Plastic QFP Packages
SOIC (Small Outline IC) & SSOP (Shrink Small Outline Packages)

Hermetic Packages:

Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been HCC’s ( www.hccindustries.com ) exclusive Agent in China/HongKong/Taiwan since 15st May 2007.

We sell HCC (www.hccindustries.com) Products:

Power Surface Mount Packages
Advanced Electronic Packages
Advanced Opto-electronic Packages

Lids and Covers:

Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been Hi-Rel’s (www.hirel.co.uk) exclusive Agent in Asia/China since 1st August 2006.

Combo Lids
Ceramic Lids
Lids with preforms
hydrogen & moisture getters
Hermetic step lids & covers

Major manufacturers:

Entegris
HCC Industries
Hi-Rel
Kyocera
NTK
Williams Advanced Materials
SEMPAC Inc.

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