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Semiconductor Equipments

Die Handlers

Bonder Testers

Royce 650 Universal Bond Tester:


Royce 650 Universal Bond Tester

System Features

  • Motorized height controlled microscope that stays in focus as it moves
  • 305 mm * 155 mm stage for 300 mm wafers, leadframes or substrates
  • Ultra Fine Pitch (UFP) capable
  • Image Capture Option which is Field Upgradeable.
  • Ribbon Bond testing for standard to high-end power devices
  • World language support
  • Small footprint with built-in, standard Windows XP PC
  • Test module range switching
  • Die shear up to 200 kgf
  • Robust test modules with calibration memory and tool protection
  • Various data analysis options, Oracle SQL compatible


Test Modules Primary Range Selectable Sub-Ranges
Wire Pull Modules 100 gf :
1 kgf :
10 kgf :
10 gf
100 gf
1 kgf
20 gf
200 gf
2 kgf
50 gf
500 gf
5 kgf
100 gf
1 kgf
10 kgf
Die Shear Modules 20 kgf :
200 kgf :
2 kgf
20 kgf
5 kgf
50 kgf
10 kgf
100 kgf
20 kgf
200 kgf
Wire Bond Shear Modules 250 gf :
1 kgf
:
5 kgf :
25 gf
100 gf
500 gf
50 gf
200 gf
1 kgf
100 gf
500 gf
2 kgf
250 gf
1 kgf
5 kgf
CBP / Tweezer Pull Modules 100 gf :
1 kgf :
10 kgf :
10 gf
100 gf
1 kgf
20 gf
200 gf
2 kgf
50 gf
500 gf
5 kgf
100 gf
1 kgf
10 kgf
Module Accuracy 0.15% of Primary Range


System Specifications

Internal Computer Integrated high performance industry standard PC.
Internal DVD-CD RW drive, USB, network ports
Servo driven X/Y Stage Standard, 305 mm x 155 mm
X,Y Resolution 1 micron
Z Resolution 0.1 micron
Step back accuracy 1 micron over 25 micron travel
Loop Height Measurement Yes
Force Profile Yes
International Standards Mil Std 883, Mil Std 750, ASTM F1269, JESD22-B117,
JESD22- B116 and CE Certified. Lead free ROHS compliant.


Mainframe Dimensions & Facility Requirements

Dimensions Height - 560 mm, 25 in
Width - 432 mm, 17 in
Depth - 585 mm, 23 in
Weight 55 kg, 120 lbs
Power Supply Automatic International voltage selection 110 to 220 VAC 50 to 60 Hz
Pneumatic Supply 4.0 - 5.5 bar (60-80 psi)
Vacuum Supply 500 mm Hg, 25 in Hg


For high speed applications, please contact us.




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