- Packages > Ceramic Packages > SOIC (Small Outline Integrated Circuit Packages):
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Small Outline Integrated Circuit Package (SOIC)
The SOIC includes the popular "gullwing" and "J-bend" lead shape.It has been proved with surface mount performance characteristics and has been designed to adopt easily to all SMT processes and lines.The SOIC meet the need for dense placement of chips on boards. It is with 50 mil lead spacing. Ceramic SOICs typically come in 8- 28 leads. We also provide plastic version of SOIC with various Lead count.
Features:
- Surface Mount Package
- Broad die pad selection
- Comparable Foot Print with wide body plastic SOP
- High conductivity copper leadframes
- J-bend and Gull Wing Lead Configuration
- Solder plate lead finish(Pb-Sn,Sn-Bi,Matte Sn available)
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