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System DE35-ST Semi Automatic Die handler
- Available for 150 and 200mm diameter wafers.
- Picks die as small as 6mil square.
- 700 to 1200 UPH throughput. Application dependent.
- Quick change multi-needle eject heads.
- Programmable output stage for waffle pack and Gelpaks. Alternative output formats also available.
- Pick and place program storage.
- Optional non-surface contact capability.
The DE35-ST Semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Paks®, film frame or directly on substrates.
The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35i requires no hand tools for die size changeover and setup.
Setup and option information is preserved in non-volatile memory so that, following a weekend shutdown for example, you can restart the machine without further setup.
Waffle pack pockets for die placement are automatically selected. Manual selection using the keyboard arrow keys enables completion of partially filled waffle packs. If a grading output mode is selected, the machine places the die in the next pocket of the corresponding waffle pack and advises the operator when any of the waffle packs are full.
Non-Surface Contact (NSC) Option
NSC safely picks die with fragile surface geometry or coatings, for example GaAs die with air-bridges or MEMS devices. Die sizes range from 150µm square to over 25mm sq.
Picks die without touching the top surface, ideal for handling die with touch sensitive coatings. Excellent for gripping force under 10g. Picks dies from 0.06 inch square to over 1.0 inch square. Die are gripped by Vespel conductive plastic finger tips. For small die sizes, micro-machined collets are available to suit individual applications.
Die Underside Inspection Option
Contamination from tape adhesive or backside mechanical defects can be readily identified before placing the die in the output carrier.
Facet Inspection Option
Die edge defects can be inspected using the facet inspection option. Several choices of magnification and illumination are available to suit customer require¬ments. Please contact our applications team for more details.
High Precision Die Eject Option
The high resolution die ejector is key to handling ultra-thin die without damage. Speed, acceleration and needle stroke are all saved with process recipes for rapid recall.
Optional Die Inverter
After a die is picked from the wafer, it can then be inverted and placed into the output carrier.
Technical Specification:
- Samllest Die size: 0.006inch square
- Largest Die Size: Over 1.0 inch square
- Largest Wafer: 8 inch
- Precision: ± 0.005 inch
- Die Pick up Loading: Adjustable to under 10g
- Machine Throughput: 700 to 1200 UPH
- Machine Dimensions: 30-inch wide, 26-inch deep, 30-inch high
- Machine Weight: Approx. 70 lbx
- Vacuum Supplies: 25 in Hg minimum
- Die Ejector: CCTV with crosshair
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