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Semiconductor Glossary:

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Semiconductor Glossary - B

  • B&W

Black & White

  • Back-End (BE)

In the semiconductor industry, Back End corresponds to the second phase of manufacturing during which the silicon chip is mounted in a package designed (assembly) not only to protect it, but also to provide external connections via a series of very fine wires, followed by testing, assembling, finishing and packing.

  • BACM

Best Available Control Measure

  • BACT

Best Available Control Technology

  • BADT

Best Available Demonstrated Technology

  • Baka-Yoke

A Japanese term indicating the conception and use of devices or gadgets which, connected to an indicator (for example a warning light) signal the presence in a production line of an incorrect or defective component. Immediate corrective action prevents from entering the next production phase, which would make it more costly to correct the problem and more difficult to trace its causes.

  • Ball Bonding

See Bonding, Ball

  • Band gap

Interval of energy forbidden to the free electron.

  • BaP

Benzo(a)pyrene

  • Barcoding

Machine/optical read capability labeling of packages for shipping and receiving transaction information such as part number, quantity, invoice number, etc.

  • Base

The control portion of a bipolar transistor. In an NPN transistor, the P-type material forms the base.

  • Base Diffusion

The diffusion during which the base regions of transistors are formed.

  • BASIC

Beginners All-purpose Symbolic Instruction Code

  • BAT

1) Best Available Technology Best Available Technology is defined as the treatment or abatement technology which, given the various options available on the market and the results that each option can guarantee, provides the required results at the lowest cost. Therefore, the BAT concept is strictly related to various factors such as time (technologies change with time); space (availability and cost of a given technology may be different from country to country); utilization (the same result may be reached with different technologies); and results (the result to meet is not the best possible, but what is required by law, by corporate specifications, etc.). 2) Bon A Tirer

  • Batch

A number of wafers processed as a group.

  • BATEA

Best available Treatment Economically Achievable

  • BATNEEC

Best Available Technology Not Entailing Excessive Costs

  • Battery

A direct current voltage source made up of one or more units that convert chemical, thermal, nuclear, or solar energy into electrical energy. Common batteries provide electricity for use of portable electrical equipment such as radio, telephones, cameras, or even cars, motorbikes and trucks. These type of batteries contain hazardous substances such as sulfuric acid or heavy metals. In the past the batteries used to contain mercury, lead, zinc, nickel and cadmium. Lead is now still used for cars batteries, but is being substituted in small batteries with non-polluting substances such as lithium and manganese. In most countries spent batteries are collected separately and recycled.

  • BBC

British Broadcasting Corporation

  • BBS

/bulletin Board System Computer connected to telephone network and used for exchange of information like a notice board. User may post information and read material posted by others. In ST used on cc:Mail.

  • BBi

Bare Board Test

  • BCC

Blind Carbon Copy

  • BCCT

Best Conventional Control Technology

  • BCD

1) Bipolar-CMOS-DMOS A technology specific to ST. Abbreviated form of Multipower-BCD. IC manufacturing technology invented by ST in 1986 that combines bipolar, CMOS and DMOS on the same chip. 2) Binary Coded Decimal Method for coding decimal numbers in binary by storing each digit in a 4-bit nibble.

  • BCF

Bioconcentration factor

  • BCPCT

Best Conventional Pollutant Control Technology

  • BCT

Best Control Technology

  • BDAT

Best Demonstrated Available Technology

  • BDCT

Best Demonstrated Control Technology

  • BDT

Best Demonstrated Technology

  • Beam leads Thick, strong leads deposited directly on an integrated circuit chip and used for interconnecting the circuit into the system.
  • Beam tape

Polyamide tape supporting copper foil shaped into beam leads form TAB bonding. Specifically designed for in-line automation of IC packaging.

  • BEI

Biological Exposure Index

  • BEJ

Best Engineering Judgment

  • Bench-marking

One of the process improvement tools. It consists of ranking and rating one's performance as compared with that of other organizations and systematically defining the best systems, processes, procedures and practices. Benchmarking starts with self-study, it measures your processes against those of recognized leaders. It will help to establish priorities and targets that lead to competitive advantage.

  • Benzene

Is the simplest aromatic hydrocarbon. The chemical formula is C6H6. Benzene is used in the chemical industry as a solvent and as a starting compound for the synthesis of a variety of other materials, such as rubber, paint and plastics. It is a volatile liquid, and emissions are regulated as a toxic air pollutant. Benzene is a known carcinogenic. The major toxic effects of chronic exposure concern the functioning of the bone marrow. A variety of blood disorders, such as plastic anemia and leukemia, have been linked to excessive doses.

  • BER

Bit Error Rate

  • BEST

Byte Erasable Super flash Technology

  • Best-In-Class

The best performer in a group of companies, for a given performance measure.

  • Betacam

Professional videocassette standard. Uses 1/2 inch tape.

  • BEV

Billion Electron Volts

  • BFETL

Buffered Field Effect Transistor Logic

  • BGA<

Ball Grid Array A family of packages for surface mounting.

  • BHC

1) Bromohydrocarbon 2) Benzene hexachloride

  • BHP

Biodegradation, Hydrolysis and Photolysis

  • BIBA

BIlling + BAcklog Projection of total billings over a period of time (generally the full year) comprises billings already done + orders to be delivered.

  • BiCMOS

Bipolar-CMOS A technology where the advantage of bipolar (a transistor) noted for its speed. It contains an emitter, collector, and base and that of CMOS devices (low power consumption) fabricated on a single chip.

  • BID

Buoyancy Induced Dispersion

  • BlFs

Boilers and Industrial Furnaces

  • BIFET

BI-polar Field-Effect Transistor

  • Billings

In the semiconductor industry, after the parts have been shipped we send the customer an invoice. At this stage the order is said to be billed, meaning that the customer owes us the money. Thus billings is a measure of the money due to ST.

  • Binary

A system of numbers using 2 as a base. In contrast to the decimal system which uses 10 as a base. The binary system requires only two symbols: 0 and 1.

  • BIND

A protocol and system used throughout the Internet to map Internet Protocol (IP) addresses to user-friendly names. DNS is sometimes referred to as the BIND service.

  • Bioaccumulation

The increase in concentration of a chemical in organisms that live in environments contaminated with low concentrations of certain organic compounds or heavy metals such as lead and mercury. Chemicals which bioaccumulate are not readily decomposed in either the environment or in an organism and are likely to be stored in the fatty tissue. As these organisms are eaten by predators, the concentration of the chemicals progressively increase in the predators until toxic levels are reached. For example, fish living in water contaminated with small concentrations of compounds such as PCB's, DDT or other bioaccumulators will absorb these compounds through the gills or through the other aquatic species which they eat. Any animal species preying on the fish, such as certain species of bird (or humans), will further build up the concentrations of these chemicals in their bodies.

  • Biocide

A chemical substance that kills living organisms. The designation is usually used to include materials that can kill desirable as well as undesirable organisms (e.g. pesticides are designed to kill undesirable organism).

  • Biodegradation

The metabolic breakdown by living organisms of materials into simpler components. The degradation is usually performed by bacteria or microbes, referred to as decomposers. It is a fundamental process, since the more elementary components can be riutilized in the environment for other processes. Nearly all materials obtained from natural raw materials (e.g. wood, paper, natural fibers such as cotton or wool, etc.) are biodegradable, whereas many substances obtained from industrial processes are not. The biodegradation capacity of a substance is a function of time and the media where it is dispersed. For instance, some substances are biodegradable in water but not in the soil.

  • Biodiversity

The sum of all genetic pools of species and ecosystems existing on the Earth. Biodiversity allows species and population to work out mechanisms for establishing better relationships between each other. Conservation of biodiversity is of paramount importance for the survival of species or communities on the Earth. The loss of biodiversity blocks the possibility of evolution of a community. The importance of biodiversity has been internationally recognized in a convention approved at the 1992 Earth Summit in Rio de Janeiro.

  • Biogas

Mixture of gases (mainly methane gas) produced during the anaerobic decomposition of the remains of organic wastes by bacteria. It is produced in large quantities in landfills, where it can be extracted and utilized as a fuel. If it is not extracted, it can leak out of the landfill and either collect in nearby buildings until explosive levels are reached or it can kill surrounding trees and vegetation by poisoning the roots.

  • Biological Treatment

Treatment of waste water to remove or reduce organic contaminants using decomposing bacteria. The traditional treatments use aerobic bacteria, to mineralize the organic contaminants to carbon dioxide and water. An "activated sludge", consisting of the bacterial mass, is mixed with the incoming wastewater and left to work on the organic contaminants. The sludge, now increased in mass because of the decomposition processes, is then separated from the wastewater. Part is recycled to start the process again, part needs to be disposed. The clarified wastewater is then discharged. The sludge which is disposed of can be used as fertilizer on agricultural fields (if the levels of contaminants, especially heavy metals, are not too high) or it can be decomposed anaerobically to generate biogas or it can be incinerated. Specialized biological treatment can be used to reduce the levels of ammonia, nitrates and other nitrogen-containing species. Specific nitrifying and denitrifying bacteria are used in this case. Biological treatment is mostly used by municipal waste water treatment works, to treat household waste waters (but also industrial waste waters). In industry, it is used extensively in the food-processing industry and the oil industry where waste waters with high levels of organic contaminants are generated.

  • BIOS

1) BInary Operation System 2) Basic Input-Output System

  • Biosphere

Also called Ecosphere. It is the entire planetary ecosystem, including all living organisms and the parts of the Earth in which they live or that support them. It includes the atmosphere, the hydrosphere and the lithosphere. The biosphere was formed 4.6 billion years ago.

  • Bipolar

1) A type of transistor where a flow of both conduction electrons and holes determines the device characteristics. 2) A transistor noted for its speed that contains an emitter, collector and base.

  • Biport

ST Trademark for dual ported RAM.

  • BIST

Built-In Self Test

  • Bit

A binary digit. A bit is the smallest unit of storage in a digital computer, and is used to represent one of the two states in the binary number system.

  • BK

BooK

  • B/L

Backlog The order book comprising orders to be delivered and invoiced. The term also means a production delay. By extension, to carry out a backlog is to study the delayed production portfolio.

  • BL

1) Bits Line. 2) Battery Low output (signal name).

  • BLP

Bromine-Loading Potential

  • BMP

1) Best Management Practices 2) (windows) bitma

  • BO/BI

Book to Bill A trend indicator equivalent to the ratio between orders booked during the month to orders delivered (invoices sent out). If the Book-to-Bill ratio is greater than one, it means that the conditions of the business are improving. If less than one, they are worsening.

  • Boat

A wafer holder made from quartz or polycrystalline silicon for use in furnace operations of semiconductor fabrication. Also may be made of teflon for transporting wafers between processing locations.

  • Boat Puller

A electro-mechanical device interfaced to the oxidation/diffusion furnaces for inserting or removing at a given rate a number of boats loaded with wafers.

  • BOC

Biodegradable Organic Coumpound

  • BOD

Biochemical Oxygen Demand The amount of oxygen dissolved in water required for the decomposition or metabolism by microbes of biodegradable organic compounds. The greater the amount of waste material (organic carbon) in the water, the greater will be the dissolved oxygen needed to decompose or metabolize the organic material. Since dissolved oxygen is required by organisms native to a body of water such as fish, BOD is a measure of the ability of a waste to cause damage in a receiving stream or lake. The customary units of the BOD measurement are milligrams of oxygen utilized by one liter of wastewater incubated for five days. For this reason, BOD is also indicated as BOD5. The BOD of untreated municipal sewage is about 250 mg/l, that of unpolluted water is about 5 mg/l.

  • BOD5

Biochemical oxygen demand - 5 days (BOD in wastewater incubated for five days) see above - BOD

  • BOE

Buffered Oxide Etch A hydrofluoric acid and ammonium fluoride solution used to etch silicon dioxide.

  • BOK

Battery OK

  • BOM

Bill Of Material 1) The BOM is the list of the direct materials and their quantities to assemble a raw line. 2) List of devices inside a board.

  • Bonding

In semiconductor production, this is the connection of bonding pads on the surface of the die to the package frame. Bonding is normally done by welding tiny gold or aluminum wires. Not to be confused with die attach.

  • Bonding, Ball

A thermal compression bonding technique used only with gold wire. The wire end is melted to form a ball, which provides a larger area of contact than otherwise possible.

  • Bonding, Die

Attaching of the semiconductor die to the package substrates, with epoxy adhesives, gold eutectic or solder alloy. Also called die attach.

  • Bonding Pads

Comparatively large metallization areas usually placed around the perimeter of the integrated circuit die to provide the areas to which wires from internal termination of the leads of the package are connected.

  • Bonding Wedge

A form of thermal compression bonding used for microelectronic assembly, so named because the bond shapes the wire in a wedge shape.

  • Bonding Wires

Fine wires, usually aluminum or gold, connecting the metal bonding pads on an integrated circuit to the internal termination of the leads of the package.

  • Boolean Algebra

A logical calculus names for mathematician George Boole, using alphabetic symbols to stand for logical variables, and 0 and 1 to represent states. AND, OR, and NOT are the three basic logic operations in the algebra. NAND and NOR are each combinations of two of the three operations.

  • Bookings

When an order is entered it is said to be booked. The total value of orders booked in a given period is called bookings.

  • Boostrap Program

Built-in instructions that take effect when a computer is turned on and prepare a computer for operation. Normally called, "booting" up a computer.

  • BOR

Bill of Resources List of resources needed to produce a device.

  • Boron

The P-type dopant commonly used for the isolation and base diffusion in stand bipolar NPN-IC processing, and source/drain regions in PMOS transistors.

  • Boron Trichloride

A gaseous mixture of boron and chlorine. The mixture is used as a dopant source for P-type diffusions and as an etchant gas for etching aluminum and aluminum alloys.

  • Bottleneck

The operation in a manufacturing sequence that limits the overall speed or capacity.

  • Boule

A term used to describe the single-crystal silicon mass after the crystal growing process. Also called ingot.

  • Bouskoura

A town 24km from Casablanca, Morocco, where ST assembly plant is located. This plant was originally a subcontractor for various companies (including ST, Valeo and IBM). In 1993 it became an assembly plant producing subsystems and radio frequency products. There is another ST plant in the Ain Sebaâ area of Casablanca.

  • Box plot

Graphic summary of a distribution where the overall dispersion and the central tendency or mean of the data are highlighted.

  • BP

Boiling Point

  • BPI

1) Business Process Improvement The practice of flow charting a process, accurately defining customer needs, identifying non-productive work, and redesigning the process to better meet the needs with less chance of errors and at a lower cost. 2) Bits Per Inch 3) Business Process Improvement

  • BPJ

Best Professional Judgment

  • BPM

Business Process Management A Management system in which major inter-departmental problems are assigned a Process-Owner who is responsible for solving the problem, regardless of what organizational boundaries are crossed.

  • BPS

Bits Per Second The measure of speed at which data is transferred over a network.

  • BPSK

Binary Phase Shift Keying

  • BPT

1) Best Practicable Technology 2) Best Practicable Treatment

  • BPWTT

Best Practical Waste Water Treatment Technology

  • BQFP

Metric plastic Quad Flat Pack with corner bumpers and english lead pitches.

  • Br

Bromine

  • Brainstorming Technique for generating ideas. In a conventional meeting each idea is evaluated when it is proposed - in a brainstorming session ideas are simply proposed but not judged. The benefit is that some ideas which would have been rejected may lead to useful ideas and stimulate creativity.
  • BRAM

Burst Random Access Memory

  • Brazing

The process of joining two or more metals by partial fusion with a layer of hard-soldering alloy at high temperatures.

  • Breakdown Junction

A high carrier conduction condition arrived at as a result of the field (voltage) being sufficient to cause this high level of conductance.

  • Breakthrough

An improvement to an unprecedented level of performance (or knowledge) in service, product or process (conversely it can be seen as a dramatic reduction in the percentage of defects, wasted resources or level of ignorance on a specific subject). In the context of Total Quality Management, the term is applied mainly in relation to obtaining new knowledge that will provide a vision, an understanding, at a level never reached before.

  • Bristol

Town in south west England. ST site (formerly headquarters of INMOS) is located on the outskirts.

  • Browser

A computer program used for navigating on the World-Wide Web or Intranet webs. Mosaic and Netscape are examples.

  • Browsing

Searching for information on the worldwide web.

  • BSA

Build Sheet Assembly ST document specifying how a product is to be assembled.

  • BSI

British Standards Institute

  • BT

Most commonly used substrate material for BGA's. Higher temperature relative of FR-4.

  • BTAB

Bumped Tape Automated Bonding A bonding process using inverse beams with solder (or other) bumps on the beams instead of on the chips. Obviates the need for special bumped chips.

  • BT

British Telecom

  • BTO

Build To Order

  • BTU

British Thermal Unit

  • BTW

By The Way

  • BU

Business Unit A subset of a Product Group defined in terms of product family or market segment.

  • Bubbler

A container holding a liquid through which some type of inert carrier gas is passed to carry some partial pressure of the liquid into a process tube or a reaction chamber.

  • Bug

A defect or problem in computer software, any type of hardware or a procedure.

  • Bumped Chip

A chip from a wafer that has been specifically processed with buffer metal(s) over the 1/0 pads, followed by an addition of solder or gold "bumps" to provide re-flow or thermocompression bonding areas for copper beam-lead attachment.

  • Buried Layer

A low-resistivity, diffused region placed under the collector of a bipolar transistor to reduce its series resistance, commonly employed with an epitaxial structure.

  • Burn-in

Applying voltage to a semiconductor device at an elevated temperature for a given period of time to cause devices with marginal reliability to fail, eliminating potential field failures.

  • Business process

The end to end sequence of repetitive steps and activities, involving one or more company's functions, required to deliver a service (as opposed to processes that product tangible goods). The Customer of a business process may be an internal customer (e.g. distributing the Company's internal mail) or an external customer (e.g.. prepare and deliver an invoice). In Company management, business processes are normally measured in terms of their effectiveness, efficiency and considering constant market evolution, their adaptability.

  • BUT

Board under Test

  • Byte

Normally 8 data bits together, allows 28 different values (256).

  • Bytewide

ST Trademark for memory/packing standard.

  • BW

Bandwidth

  • BWR

Boiling-Water Reactor


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