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Semiconductor Glossary - S

  • 90Sr

Strontium-90

  • S

Sulphur

  • S&A

1) Sampling and Analysis 2) Surveillance and Analysis

  • S/S

Stabilization/Solidification

  • SA

1) Sales Associate 2) Schottky Array 3) Selective Availability A now obselete DoD program that controlled the accuracy of GPS pseudorange measure-ments, degrading the signal available to non-qualified receivers.

  • SADA

1) Sales And Debit Administration A procedure to provide pricing flexibility to distributors. 2) Ship and Debit Authorization

  • SAM

1) Served Available Market 2) Serviceable Available Market That part of the total market covered by the Company's product range (see also TAM: Total Available Market). 3)Scanning Acoustic Microscopy 4)Surface Acoustic Microscopy Uses ultrasonic waves to non-destructively image the interior of packages.

  • SANE

Sulphur and Nitrogen Emissions

  • SARA

Superfund Amendments and Reauthorization Act

  • SAS

Sensitive AC Switch

  • SAV

Submerged Aquatic Vegetation

  • SAW

Surface Acoustic Wave

  • SBS

Silicon Bilateral Switch

  • SBM

Supplier Business Manager

  • SBU

Semicustom Business Unit

  • S/C

Steering Committee

  • SCA

Switched Capacitor Array

  • Scaling

A technique of reducing the size of an existing integrated circuit die by selective shrinking of the X and/or Y dimensions.

  • Scanning Electron Microscope

A specific electronic microscope that uses an electron beam to scan a (SEM) specimen, under vacuum, providing a very high magnification of the surface. This magnification is generally in the range of lOx 100,OOOX.

  • Scanning Projection Aligner

An optical system that uses a slit of light to transfer the mask image to the photoresist-coated wafer. The slit of light is scanned across the mask and is projected onto the wafer.

  • SCBA

Self Contained Breathing Apparatus

  • SCC

Serial Communication Controller

  • SCFM

Standard Cubic Feet Per Minute

  • Schottky TTL

A form of TTL logic in which Schottky diodes are used to clamp the transistors out of saturation, effectively eliminating the storage of charge within the transistor - allowing increased switching speeds.

  • SCI

Serial Communications Interface

  • SCL

Serial Clock

  • SCM

Supply Chain Management An integrative approach for planning and controlling the flow of goods, cash and information through a distribution channel from suppliers to end users.

  • Independent firms are involved in the activities from designing, manufacturing a product to placing it in the hands of the end users.
  • The network through which these firms pass goods and simultaneous information, can be re-ferred to as a supply chain or network.
  • Supply chain members can include customers, suppliers, carriers, vendors, distribution centers, and other third parties.
  • SCP

Supply Chain Planner The tools for planning the integrated production flow

  • SCR

Silicon Controlled Rectifier

  • SCRAP

A decision statement that a product that does not comply with the legal, statutory, contractual, technical requirement etc.., cannot be used or recovered after reworking and must be destroyed.

  • Scribing

The operation of cutting a wafer into dice with a diamond saw.

  • Scribe Line or Saw Lane

The separation between adjacent die on the wafer. This path is used as the cutting area in sawing a wafer into the individual die.

  • Scrubber

A device that uses a liquid spray to remove aerosol and gaseous pollutants from an air stream. The gases are removed either by absorption or chemical reaction. Solid and liquid particulates are removed through contact with spray.

  • SCS

Silicon Controller Switch

  • SCSI

Small Computer System(s) Interface Trademark

  • SCU

Serial Communication Unit

  • SDC

Secondary DC-DC Conversion

  • SDCA CYCLE

Standardize, Do, Check, Act

  • SDFL

Schottky-Diode Field-effect transistor Logic

  • SDH

Synchronous Digital Hierarchy

  • SDI

Strategic Defense Initiative

  • SDIP

Shrink Dual In Line Package

  • SDLC

Synchronous Data-Link Control

  • SDP

Software Data Protect

  • SDR

System Design Review A review conducted to evaluate an engineering process and associated technical requirements, in order to plan subsequent phases.

  • SDRAM

Synchronous Dynamic Random Access Memory

  • SDWA

Safe Drinking Water Act

  • SEC

Site Environmental Champion

  • SECAM

Sequential Couleur a Memoire French standard coding system for color TV broadcasting, similar to the German PAL system. SECAM is used in France and countries of the former Soviet Union.

  • SEIA

Socioeconomic Impact Analysis Selective Etching Etching that is done so that certain material is dissolved, but other materials are not affected by the etchant.

  • SEM

Scanning Electron Microscope Equipment used to analyze defects.

  • SEMATECH

SEmiconductor MAnufacturing TECHnology A non-profit technology development consortium of US semiconductor manufacturers formed in 1987. Its development programs include: - Advanced Technology; - Advanced Tool Development Facility and Facilities Design - Front-End Processes -Interconnect International SEMATECH is a subsidiary formed in 1998 to include the participation of non-U.S. companies. Its research programs include: - 300 mm integration and standards - Environment, Safety and Health (ESH) - Lithography - Manufacturing Methods SEMATECH and International SEMATECH are unique endeavors of 14 semiconductor manufacturing companies from seven countries. Located in Austin, Texas, USA, the consortia strive to be the most effective, global consortia influencing semiconductor manufacturing technology. SEMATECH and International SEMATECH work with members, equipment and materials suppliers, research organizations, academia, and other consortia to accelerate the development of advanced precompetitive semiconductor manufacturing processes, materials, and equipment for their member companies. Development results are validated in SEMATECH's Advanced Tool Development Facility, which simulates manufacturing production lines. Consortia participants benefit from early access to leading-edge tools and manufacturing processes, as well as improved equipment productivity.

  • SEMI

Semiconductor Equipment and Materials Institute

  • Semiconductor

The type of material such as silicon whose electrical conductivity is between that of a conductor and that of an insulator -in being nearly as great as that of a metal at high temperatures and nearly absent at low temperatures. These unusual properties are exploited to produce transistors and electronic devices.

  • SERDES

Serializer/Deserializer

  • Serial

Pertaining to data or instructions that are processed in sequence, one bit at a time, rather than in parallel (several bits at a time).

  • Server

A networked computer that provides information to other computers in the network. Servers are commonly used to give many people access to the same files.

  • Sewer

A channel that carries waste water and stormwater run-off from the source to a treatment plant or receiving stream.

  • SFA

Spectral Flame Analyzers

  • SFC

polyStyrene Film Capacitor

  • SFN

Signal Frequency Network

  • SFO

Shippable Frame Order

  • SFN

Signal Frequency Network

  • SFV

Semifinished Variation

  • SG

Signal Ground

  • SGA

Sales General Agreement

  • SGML

Standard Generalized Markup Language

  • SGP

St Genis Pouilly Small village in southeast France, close to Geneva. Location of ST Corporate headquarters.

  • SGS

Società Generale Semiconduttori Italian precursor company of ST. Founded in Milan in 1957. Moved to newly built Agrate plant in 1958.

  • S/H

Sample and Hold

  • S/N

Signal to Noise(ratio)

  • Shared values

The Mission, Vision, Strategic Guidelines & Guiding Principles that define the Company's purpose and provide guidance for strategies and behavior for all personnel.

  • Sheet Resistance

Sheet resistance is a characteristic of material that is formed in such a way so that its resistivity is not a function of its cross-sectional structure. Sheet resistance is expressed as RS in terms of ohms per square, where the square refers to surface area but has no absolute dimensions.

  • Shortform catalog

A catalog produced annually containing condensed information about ST products.

  • SHWL

Seasonal High Water Level

  • Si

Silicon The group IV element used for fabricating diodes, transistors and integrated circuits.

  • SIA

Semiconductor Industry Association

  • SIC

Standard Industrial Classification

  • SICOM

(Or ESICOM) Software used to manage the customer orders, from order entry to shipments.

  • SID

S-Interface Device

  • Side-brazed Ceramic Package

A multilayer ceramic dual in-line package (DIP) with external leads brazed on the sides of the package.

  • SiGe

Silicon-Germanium Semiconductor IV-IV alloy used as thin layer to improve device performances.

  • Silicides

The reaction of a metal with silicon, forming a metal-silicon compound, i.e., PtSi (platinum silicide).

  • Silicon

The basic element used in most semiconductor devices; i.e.; diodes, transistors, and integrated circuits.

  • Silicon Dioxide

The compound of silicon and oxygen used for insulation (isolation), passivation, or a masking layer in semiconductors.

  • Silicon foundry

A semiconductor manufacturing company or division that produces circuits designed by other companies. Silicon foundries are used by "fabless" companies, by equipment makers with their own IC design capability and by semiconductor companies that need more capacity.

  • Silicon-Gate MOS

MOS devices with a polycrystalline silicon layer deposited to form the gate elements.

  • Silicon Nitride

The compound of silicon and nitrogen used as a masking layer during processing and as a final passivation layer at the end of the process sequence.

  • SIM

Subscriber Identification Module The card or module which contains a memory where details about a GSM cellular telephone subscriber are stored. GSM telephones are "programmed" by inserting this card, so that a telephone can be used by anyone having a card. In addition to the user identification number and phone number, the SIM also holds the personal number memory and preference information.

  • SIMM

Single Inline Memory Module

  • SIMS

Secondary Ion Mass Sectroscopy

  • Simulator

A device that enables the operator to reproduce or represent under test conditions phenomena likely to occur in actual performance.

  • Simultaneous Engineering

The development of new designs through cross-functional teams. Also called Concurrent Engineering.

  • Singapore

City in south-east Asia where there are two ST plants - Ang Mo Kio and Toa Payoh.

  • Single-Crystal

A piece of material having a continuous, regular crystalline lattice structure and having no internal grain boundaries.

  • SIO

Serial Input/Output

  • SIP

Single In-line Package With a single row of pins (in picket-fence style). Package is usually mounted in the vertical plane.

  • SIPO

Serial In Parallel Out

  • SIR

Surface Insulation Resistance Typically a moisture test to determine the surface leakage of a package or chip.

  • SITE

Superfund Innovative Technology Evaluation program

  • Skip testing

Procedure used to save time in testing high yield integrated circuits. Sample of dice on wafer is probed and if yield is above certain threshold all of the dice are assembled. Any bad dice that pass the wafer test are eliminated at the final test.

  • SKU

Stock Keeping Unit

  • SLC

Single Layer Ceramic

  • SLIC

Subscriber Line Interface Circuit

  • SLIP

Serial Line Internet Protocol

  • Slice

Another term for wafer.

  • Sludge

A general term used to designate a thick suspension of waste products having the consistency of paste or soft mud, such as the particulate waste collected during the treatment of waste waters. Sludge high in organic matter is produced by municipal sewage treatment plants, food processors, refineries, and paper mills. Sludge high in inorganic matter is produced by the treatment of the wastewater generated by many types of industrial processes.

  • SM

Senior Management Surface Mount

  • SMART

A plan should be S (specific), M (measurable), A (achievable), R (relevant), T (time related).

  • Smartcard

Smartcards are plastic cards the size of a credit card, which interface to network terminal de-vices. They are used for a variety of purposes including banking and personal identification applications. Smartcards have an embedded IC, which usually includes programmable mem-ory and/or a microprocessor. Security is the most important issue in the use of smartcards and data encryption features protect the card from invalid use.

  • SmartFinger™

The SmartFinger™, is a miniature biometric module, combining fingerprint recognition and on-screen navigation features for mobile Internet applications.

  • SMATV

Satellite Master Antenna TeleVision

  • SMCL

Secondary Maximum Contaminant Level

  • SMD

Surface Mount Device

  • SMD

Solder Mask Defined Ball pads on BGA that are larger than its solder mask opening.

  • SMDS

Switched Multimegabit Data Service

  • S/MIME

Secured Multipurpose Internet Mail Extension SMTP Simple Mail Transfer Protocol

  • SMIP

Statistical Methods to Improve Performance

  • LI>SMOBC

Solder Mask Over Bare Copper

  • Smog

A general term used to describe any condition in which visibility is reduced because of air pollution. The word is a combination of smoke and fog and was first used in Great Britain when particular atmospheric conditions kept smoke low to the ground in and around London. This kind of smog disappeared when strict rules were introduced on the burning of smokeless fuels in the 1950's. The term is now most commonly used in the context of photochemical smog.

  • SMPS

1) SwitchMode Power Supply 2) Surface Mount Power Schottky

  • SMR

1) Sales Marketing Representative 2) Surface Mount Resistance Test to determine how robust a package is during surface mount soldering.

  • SMT

1) Self-Managing Team A Self-Managing Team is a work group that operates with a defined degree of autonomy and without a visible manager. A group of employees who are responsible for a "whole" work process or segment that delivers a product or service to an internal or external customer. 2) Surface Mount Technology

  • SN

Shippers number/serial number

  • SNAAQS

Secondary National Ambient Air Quality Standard

  • SNARL

Suggested No Adverse Response Level

  • SNAPHAT
  • Term for packaging for ZEROPOWER and TIMEKEEPER products, ST trademark.
  • SNG

Synthetic Natural Gas

  • SNMP

Simple Network Management Protocol

  • SNQ

Service National de la Qualité

  • SNR

Signal to Noise Ratio

  • SO

Small Outline

  • SO2

Sulphur dioxide

  • SOA

Safe Operating Area

  • SOC

1) System-on-chip 2) Synthetic Organic Chemicals

  • SOD

Sediment Oxygen Demand

  • Soft Bake

A heat treatment used after the photoresist is applied to the silicon wafer to remove the solvents from the layer.

  • Software

The programs and instructions for a computer.

  • SOI

Silicon On Insulator Similar to SOS, but with oxide or another insulting film isolating individual transistors.

  • SOIC

Small Outline Integrated Circuit

  • SOJ

Small Outline, J bend An SOIC package with i-bend leads.

  • SOLV

SOLenoid Valve

  • SONAR

SOund NAvigation and Ranging

  • SONET

Synchronous Optical Network

  • SOP

1) Standard Operating Procedure 2) Small Outline Package Typical lead pitch of 50 mils, pin counts from 8 to 32, body width of 150, 200, 300, 330 and 400.

  • SOS

Silicon-On-Sapphire. A fast MOS technology in which silicon is epitaxially grown on a sapphire wafer, and etched away between transistors. Each device is thus isolated by air or oxide from other devices.

  • SOT

Small Outline Transistor

  • Source

The working-current terminal of an FET that is a source for holes (P-channel) or free electrons (N-channel) flowing in the channel. Corresponds to emitter of bipolar transistors.

  • SOW

Statement of Work The statement of work is a document listing the work and services that must be accomplished in order to reach the objectives of a program.

  • SOx

Sulphur oxides

  • SP

1) Signal Processor 2) Stack Pointer

  • SPARC

Scalable Processor Architecture

  • SPC

Statistical Process Control The conversion of data to information using statistical techniques to document, correct, and improve process performance (use of statistical techniques, such as control charts, to control a process). A process is said to be in state of Statistical Control if the variations among the sampling results can be attributed to a constant system of common causes.

  • SPCC Plan

Spill Prevention Control and Countermeasure Plan

  • SPD

Serial Presence Detect

  • SPDS

Smart Power Development System Application development tool developed by ST for smart power integrated circuits. Consists of PC hardware and software.

  • SPDT

Single Pole Double Throw (switch)

  • SPE

Secondary Particulate Emissions

  • SPEC

Specification A document which should include, for a given manufacturing process: - A description of the process (product, raw materials, equipment, conditions of use) - All necessary indications for performing the operation. It is also a customer specification.

  • Special Causes

A factor contributing to the variation in quality that is possible to detect and identify. Also referred to as Unnatural Variation.

  • Spent Resin

The most significant waste, in terms of quantities, which back-end sites currently produce. The waste is generated in the molding processes, being the excess resin left in the molds after molding. Since these resins are thermosetting plastic, they cannot be melted and re-used as can often be done with the excess plastics generated in molding processes. Currently, these wastes are all being sent to landfill. Finding some other use for these spent resins is one of the back-ends' major technical challenges to meet the Decalogue's commitment. Various projects are in hand, notably to evaluate if the spent resins can be used in road-beds as a substitute for the materials currently used.

  • SPG

Subsystem Products Group ST organization responsible for subsystem products such as power supply modules. It was created in April 1994 when Subsystem and RF activities of the former Subsystems & Radio Frequency (SRF) group were separated.

  • SPI

1) Serial Peripheral Interface 2) Serial to Parallel Interface

  • SPICE

Simulation Program with Integrated Circuit Emphasis

  • Spider Bonding

A method of connecting an integrated circuit die to its package leads. A leadframe is placed over the chip and all connections are made by just one operation of a bonding machine. Tape automated bonding (TAB) uses this approach to interconnection.

  • Spill

Any unplanned discharge or release of hazardous waste onto or into the land, air, or water.

  • Spin or Spinning

The process used to apply the photoresist to the wafer

  • SPL

Sound Pressure Level

  • Split

A term used in the Semiconductor Productivity Network system (SPN), meaning to break up or divide a batch.

  • SPN

Semiconductor Productivity Network. A Computer Aided Manufacturing (CAM) system used in several of ST Back-End production sites.

  • Spore

Singapore

  • Spreading Resistance

A technical evaluation used to measure the dopant profile of a p-n junction.

  • SPST

Single Pole Single Throw

  • Sputtering

A method of depositing a film of material on an IC wafer. A target of the desired material is bombarded with excited ions that knock atoms from the target, which are then deposited on the wafer

  • SQC

Statistical Quality Control Statistical methods and procedures used to document and assure compliance with requirements.

  • SQFP

Shrink Quad Flat Pack

  • SQG

Small Quantity Generator

  • SQL

Structured Query Language

  • SR

Shift Register

  • SRAM

Static Random Access Memory A volatile memory, which uses little energy and retains its memory without the need for refreshing, as long as power is applied.

  • SRC

Solvent-Refined Coal

  • SRF

Subsystems and Radio Frequency Former ST organization that was responsible for all subsystem products (such as power supply modules) and radio frequency components. Previously it was also called SERF (in Italian "E" means "and"). In April 1994 the RF part was transferred to Discrete & Standard circuits Group (DSG) and the subsystems part became the Subsystem Products Group (SPG).

  • SRM

Standard Reference Method

  • SRS

SurRound Sound

  • SRW

Simultaneous Read/Write

  • SS

Suspended Solids

  • SSA

1) Sales Service Assistant 2) Sole Source Aquifer

  • SSB

Single Side Bank

  • SSD

Silicon System Design Independent IC design house based in Dublin, Ireland.

  • SSI

1) Small Scale Integration ICs containing fewer than 30 transistors. 2) Synchronous Serial Interface

  • SSL

Secured Socket Layer

  • SSM

Supplier Sales Manager

  • SSOP

Shrink Small Outline Package

  • SSP

Synchronous Serial Port

  • SSPM

1) Super Speed Power Motor 2) Scalar System Memory

  • SSR

Solid State Rectifier

  • SSS

Sales Support Specialist

  • SSTV

Slow Scan TV

  • ST

STMicroelectronics

  • st.com

The domain name for ST on the Internet. The address "/stonline/index.htm" is ST's home page on the world wide web.

  • Staff

In ST jargon a manager's staff are the first level of people reporting to our CEO. A staff-level position means that the holder is considered part of the manager's staff even if they report to another person. A staff function is one not directly concerned with the operations of the Company, for example Public Relations, Human Resources and so on.

  • Stakeholders

All those constituencies who have a legitimate concern for the performance of the company - i.e. shareholders, customers, employees, suppliers and local communities.

  • Standard Cells

Predefined logic elements that may be selected and arranged to create a custom IC more easily than through original (custom) design.

  • Standard Deviation

A measure of the dispersion of a set of values within a distribution. It is usually designated by the Greek letter sigma (standard deviation of a whole population) or by Sx (standard deviation of a sample of observations from a population).

  • Standard margin

Profit remaining after deducting from sales the cost of products at WWS (WorldWide Standard costs).

  • STAPI

ST Application Programming Interface

  • STAR

STMicroelectronics Advanced Risc division

  • STAR

ST Audio and Radio Converters

  • Static RAM (SRAM)

A type of semiconductor memory in which a pair of flip-flops are cross-coupled to hold a binary state as long as power is applied.

  • STB

Set top box

  • ST Debt

Short Term Debt

  • Std/STD

Standard

Steam Oxide The use of high-temperature water vapor to grow silicon dioxide. The source of water vapor can be from D.I. water or the pyrogenic reaction of hydrogen (H2) and oxygen(02)

  • STEL

Short Term Exposure Limit

  • STEM

Scanning Transmission Electronic Microscope

  • Step-And-Repeat Camera

An optical system that reduces an enlarged reticle image to 1X on a master plate. After each exposure, the master plate is stepped to a new position and the exposure process is repeated.

  • Step Coverage

The thickness of a thin film over topological changes relative to the thickness on the top surface.

  • Stepping Aligner

An optical system that projects (usually 5X or 1OX) reticle images on a portion of the photoresist-coated wafer. After exposure, the wafer is stepped to a new position and the exposure process is repeated.

  • Sticky foil

Thin film of plastic coated with adhesive. When a silicon wafer is cut into dice it is placed on a sticky foil to hold the separate dice together until they are attached to the leadframe.

  • STM

STMicroelectronics share as named in the New York Stock Exchange.

  • STNET

ST Network The company's internal computer communications network. It is connected to Internet through security firewall computers.

  • STOPAC

Stratospheric Ozone Protection Advisory Committee (of the US. EPA)

  • STP

Standard Temperature and Pressure

  • STPP

Sodium tripolyphosphate

  • STPR

ST Power Rectifiers

  • STPS

ST Power Schottky

  • Stratosphere

The second layer of the atmosphere above the Earth. The air surrounding the Earth consists of distinct zones, distinguished by the temperature gradient within each layer. The stratosphere begins at about 11 kilometers of altitude and extends up to about 50 kilometers. The air temperature in this layer generally increases as altitude increases. The ozone layer of the atmosphere is located within the stratosphere.

  • Stretch Goals

Goals that are impossible to reach through small improvements. The entire solution concept has to be changed to be able to reach the goal.

  • STripFET

Devices that utilize a single feature size process based on ST's patented strip layout technique that needs fewer process steps. Its only critical parameter is the width of the strip, which depends solely on the equipment resolution.

  • Stripping

The process of completely removing a coating such as photoresist.

  • STS

Ship-To-Stock

  • STTA

ST Turboswitch

  • STU

ST-University Created in 1994 with merger of research and training functions. Based at Rousset, in France, close to Aix en Provence.

  • STVIN

ST Voice Integrated Network The Company's private international telephone network previously in place before installing TINA.

  • Subcollector

See Buried Layer

  • Submicron

Describes any integrated circuit process producing features smaller than one micron.

  • Sulphates (SO4-2)

The most common ionic form of Sulphur oxides. In the atmosphere, sulphates can be present as small-diameter aerosols of solid sulfate salts (e.g., ammonium sulfate) or small droplets of sulphuric acid. Sulfates are an inhalation hazard and an important contributor to acid deposition. In the soil, sulphates serve as plant nutrients when present in appropriate concentrations. In salt marshes, sulphates can be a precursor for the microbial production of hydrogen sulfide. If sulphates are discharged in too great quantities in surface waters they can increase to unacceptable levels the amount of dissolved solids in the water (i.e., its "saltiness").

  • Sulphur dioxide (SO2)

A compound of sulfur containing one sulfur atom and two oxygen atoms. This compound is emitted naturally during volcanic eruptions, and is naturally present in the atmosphere in very low concentrations. It is also a major air pollutant produced by the burning of sulphur-containing compounds, the most significant of which are coal and oil containing high levels of sulphur-containing organic compounds. Sulphur dioxide has a strong odor and is very irritant. An excess concentration of sulphur dioxide is a major cause of acid rain and other acid deposition. Sulphur dioxide is often included in the general term sulphur oxides, SOx, along with sulphur trioxide, SO3. Sulphur oxides are often cited as "SOX".

  • Sulphuric acid (H2SO4)

A strong, highly corrosive acid. It is a colorless, oily liquid that is a strong dehydrating and oxidizing agent. The acid is a widely used industrial chemical and is formed in the atmosphere from emissions of sulphur dioxide and sulphur trioxide. It is used to clean silicon wafers and remove photoresist.

  • SuperBGA

Thin (1.2 mm) cavity down BGA from Anam. Trademarked name often (wrongly) used generically.

  • SuperH™

A family of RISC microprocessor cores produced by SuperH, Inc. an independant company founded by ST and Hitachi.

  • Supply Management

The systematic management of the suppliers through closer co-operation with key suppliers.

  • SURE

A published booklet describing our TQC program and commitment to our customers.

  • Surface Waters

A term used to cover any body of water which is to be found at the Earth's surface, hence streams, torrents, rivers, canals, lakes, reservoirs, marshes, deltas, seas, oceans, etc.

  • SUS

Silicon Unilateral Switch

  • Susceptor

A plate on which semiconductor wafers are heated during thermal processes such as epitaxy and chemical vapor deposition (CVD).

  • Sustainable Development

A form of economic development which has been summed up in the following phrase: " Sustainable development satisfies present needs without compromising the possibility of future generations to satisfy their own needs". The concept of sustainable development was formalized in 1987 by the United Nations World Commission on Environment and Development, often known as the Brundtland Commission after its Chairman Mrs. Gro Harlem Brundtland who prior to this chairmanship was Prime Minister of Norway. The concept has become the basis of most international and national environmental policies since then, starting from the 1992 Unites Nations World Environment Conference (often known as the Earth Summit). In particular, the International Chamber of Commerce has created a Business Charter for Sustainable Development (which ST has signed).

  • System-on-Chip (SOC)

Advanced semiconductor manufacturing techniques result in silicon chips with millions of transistors available, which makes it possible to put different types of functions on the same chip. So a complete system, including micro-processors, memory, analog and power, can be built to put the system on a single chip.

  • Symbolize

Semiconductor jargon meaning to mark a product with part number, logo and other information.

  • SW

1) Software 2) Short Wave

  • SWD

1) Software WatchDog 2) SoftWare Device

  • SWDA

Solid Waste Disposal Act

  • SWEAT

Standard Water Level Electromigration Accelerated Test


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