Search:
Home
Home
Die And Wafer
Die And Wafer Overview
Bare Die Line Card
Parts Search
Enquiry
Packages
Package Overview
Ceramic Packages
Metal Packages
Plastic Packages
Hermetic Packages
Lids and Covers
Enquiry
Semiconductor Equipments
Semiconductor Equipments Overview
Die Bonders
Die Handlers
Bonder Testers
Wet Benches
Other Semiconductor Equipments
Enquiry
Resource
Resource Overview
Semiconductor Glossary
Bare Die And Wafer
Semiconductor Packages
Order Enquiry
Request for Quotation(RFQ)
About Us
About Us
Contact Us
Feedback
Site Map
From Universal Enterprise
What's New!
Universal Bond Tester
MiniBond
FC300 Flip Chip Die Bonder
PPS60-P Pulse Heat Controller
Wet Benches
Search Die Catalog
Die And Wafer
Die And Wafer Overview
Bare Die Line Card
Parts Search
Enquiry
Packages
Packages Overview
Ceramic Packages
Metal Packages
Plastic Packages
Hermetic Packages
Lids and Covers
Enquiry
Semiconductor Equipments
Semiconductor Equipments Overview
Die Bonders
Die Handlers
Bonder Testers
Wet Benches
Other Semiconductor Equipments
Enquiry
Resource
Resource Overview
Semiconductor Glossary
Bare Die And Wafer
Semiconductor Packages
Glossary of Technical Terms
Order Enquiry
Request For Quote (RFQ)
About Us
About Us
Contact Us
HongKong
Shenzhen
Changsha
Shanghai
Xi'an
Beijing
Jinzhou
Feedback
Site Map
Site Map:
Home
What's New!
MiniBond
MA12 SEMI-AUTOMATIC DIE BONDER
FC300 Flip Chip Die Bonder
TCU10 Temperature Control Unit
PPS60-P Pulse Heat Controller
Wet Benches
Search Die Catalog
SELECT
Die and Wafer
Packages
Die Bonders
Die Handlers
Bonder Testers
Wet Benches
Semiconductor Equipments
ORDER
Parts Search
Request For Quotation (RFQ)
EXPLORE
Bare Die And Wafer
Semiconductor Packages
Contact Us
Site Map
PRODUCT HIGHLIGHTS
Royce Instruments Die Handlers
Royce Instruments Bonder Testers
Cammax Products
HCC Products
Hi-Rel Lids - Hi-Rel Products
Altera FPGA and CPLD products in die form
ISSI Bare Die for Multi-Chip-Module and Hybrid circuits
NEWS AND ANNOUCEMENTS
Unversal Enterprise/Shenzhen Cheer Electronics Co., LTD has been Royce Instruments' Agent in China since 1st August 2007
Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been HCC’s exclusive Agent in China/HongKong/Taiwan since 15st May 2007
Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been Cammax’s exclusive Agent in China since 1st January 2007
Universal Enterprise/ Shenzhen Cheer Electronics Co., LTD has been Hi-Rel’s exclusive Agent in Asia/China since 1st August 2006
Universal Enterprise to introduce new Wet Bench product lines
Die And Wafer
Die And Wafer Overview
Bare Die Line Card
Parts Search
Enquiry
Packages
Packages Overview
Ceramic Packages
CPGA (Ceramic Pin Grid Array)
Cerdip Package
Cerquad (Hard Glass Packages)
Hybrid (Module Packages)
LCC (Leadless Chip Carrier)
LDCC (Leaded Chip Carriers and Flat Pack)
Side-brazed Dip (Dual In-Line Ceramic Package)
SOIC (Small Outline Integrated Circuit Packages)
Transistor Outlines - TO Headers and Cans
Metal Packages
Transistor Outlines - TO Headers and Cans
Plastic Packages
Quad Flat No-Lead Packages
Open Cavity Plastic QFP Packages
SOIC (Small Outline IC) & SSOP (Shrink Small Outline Packages)
Hermetic Packages
Power Surface Mount Packages
Advanced Electronic Packages
Advanced Opto-electronic Packages
Lids and Covers
Combo Lids
Ceramic Lids
Lids with preforms
hydrogen & moisture getters
Hermetic step lids & covers
Enquiry
Semiconductor Equipments
Semiconductor Equipments Overview
Die Bonders
EDB65 Eutectic Die Bonder
EDB80-P Precision Die Bonder
DB400 Adhesive Die Bonder
DB600 Adhesive Die Bonder
MA12 SEMI-AUTOMATIC DIE BONDER
DB100 Semi-Automatic Precision Die Bonder
FC300 Flip Chip Die Bonder
MiniBond
PPS60-P Pulse Heat Controller
TCU10 Temperature Control Unit
Die Handlers
Semi Automatic System DE35-ST Die Handler
Automatic Die Handling and Sorting System
Bonder Testers
System 226 Dedicated Wire Pull Tester
Royce 650 Universal Bond Tester
Wet Benches
Other Semiconductor Equipments
Enquiry
Resource
Semiconductor Glossary
A
|
B
|
C
|
D
|
E
|
F
|
G
|
H
|
I
|
J
|
K
|
L
|
M
|
N
|
O
|
P
|
Q
|
R
|
S
|
T
|
U
|
V
|
W
|
X
|
Y
|
Z
Bare Die And Wafer
UE & Ditech - Products & Resoueces
Products & Services
Wafer Thinning
Wafer Probing
Wafer Sawing
Traying Pick & Place
Visual Inspection
Supply Forms
Waffle Trays
Known Good Die
Radiation Hard Die Products
Testing/Element Evaluation
Die Banking/Obsolescence
Sub Contract Die Processing
Standard Process Flow
Passive Components
Saving Cost - Bare Die Assembly
Bare Die
Where can I buy die ?
How do I convert from package to die ?
How do I handle and store bare die ?
What are the technical benefits ?
How can I reduce assembly costs ?
How much money will it save me ?
Semiconductor Packages
Electrical Characteristics of Ceramic SMD Package for SAW Filter
(PDF File 601KB)
Hi-Rel Hermetic Solder Seal Lids
(PDF File 191KB)
Glossary of Technical Terms
Order Enquiry
Request for Quotation(RFQ)
About Us
About Us
Contact Us
Feedback
Site Map
Email:
sales@ue.com.hk
| Tel: +852-2771 1286 | Fax: +852-2771 1025 |
Online Feedback
Copyright (C) 1992-2007 Universal Enterprise. All rights reserved.
Powered by Immedia Solutions
User Login