Transistor Outlines - TO Headers and Cans - Universal Enterprise: Semiconductor Bare Die, Wafer, Packaging Materials, Lids and Covers, Die Bonders, Die Handlers, Bonder Testers and Wet Benches distributor in China/Asia.

From Universal Enterprise

Transistor Outlines - TO Headers and Cans

Packages > Metal Packages > Transistor Outlines - TO Headers and Cans:

Transistor Outlines - TO Headers

TO Headers are intended for high reliability miniature microcircuit applications. The single piece construction provides great strength and resistance to stress. The absence of sidewalls helps to facilitate circuit installation, as well as inspection and test accessibility. Our TO Headers are standard so they'll meet mostly any requirement.

We also stock a wide variety of TO-Cans (caps) for the TO Headers.

Features:

High reliability
Wide variety of sizes and Lead counts

TO Cans

TO Cans are available in a wide assortment of sizes designed to work with the transistor outline---TO headers.

We also stock a wide variety of TO-Cans (covers) for the TO Headers.

TO Cans are available with weld projection as well as solder seal.

Retrieved from "http://www.ue.com.hk/index.php/Transistor_Outlines_-_TO_Headers_and_Cans"