Ceramic Packages

  • CPGA (Ceramic Pin Grid Array)
  • Cerdip Package
  • Cerqual (Hard Glass Packages)
  • Hybrid (Module Packages)
  • LCC (Leadless Chip Carrier)
  • LDCC (Leaded Chip Carriers and Flat Pack)
  • Side-brazed Dip (Dual In-Line Ceramic Packages)
  • SOIC (Small Outline Integrated Circuit Packages)

Metal Packages

  • Transistor Outlines - TO Headers and Cans

Hermetic Packages

  • Power Surface Mount Packages
  • Advanced Electronic Packages
  • Advanced Opto-electronic Packages

Plastic Packages

Lids and Covers

  • Combo Lids
  • Ceramic Lids
  • Lids with Preforms
  • Hydrogen & Moisture Getters
  • Hermetic step Lids and Covers

semipackages

Major Manufacturers

  • Entegris
  • HCC Industries
  • Hi-Rel
  • Kyocera
  • NTK
  • Williams Advanced Materials
  • SEMPAC Inc.

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