The Hybrid Package (MCM) is a high-density IC packaging. The high-speed performance and thermal advantages of the MCM package provide the platform for increased enhancement for mixed semiconductor technologies such as Analog/ Digital, bipolar/CMOS, ASIC, DSP, etc. in a single IC package. This MCM technology allows existing and presently available ICs to be designed in a single, space-saving, low-cost system package. The MCM may consist of a single construction or be made up of sub-modules. Each module usually contains a compartment to house the hermetically packaged hybrids and discrete passive component parts such as transformers, axle-lead resistors, etc. The hybrid package is a special carrier of hybrid microcircuits and other components interconnected as one unit, or as a component of an electronic subsystem.

These packages come in a wide variety of package configurations: Ceramic, Metal, DIP style and Flat Pack.

Features:

  • Improved thermal performance
  • Superior electrical performance
  • Very low design and tooling cost
  • Flexible circuit designs
  • Versatile substrate routing
  • Choice of package body size