HCC Aegis has produced a series of lightweight, hermetic, high efficiency and low thermal resistance packages to satisfy the ever-changing needs of the microelectronics industry.

Features:

  • Offers low profile, multilayer, co-fired, co-planar feedthrus, in conjunction with a highly efficient thermal management base.
  • Design for either high-frequency impedance match, DC circuits or a combination of both.
  • Resistance or laser weldable and compatible with existing sealing systems.
  • Base materials can be designed to match substrate TCE, reducing induced thermal stress over a wide range of operating temperatures.

Application Include:

  • Navigation equipment (GPS)
  • Weapons Systems
  • Military Satellites and Aircraft
  • Radar Systems
  • Test and Measurement Equipment (RF Frequency)
  • Engine Controllers
  • Medical Equipment
  • Communications
Typical Material Combinations
Material
Base Conductivity W/m ~K
CTE X 10-6/~C
Density LBS/in 3
Ring Frame Material
ASTM F-15 Alloy 14 4.9 .302 ASTM F-15 Alloy
W/Cu 175 - 205 6.5 - 8.3 .535 - .611 Fe Ni Alloy
Mo/Cu 165 - 185 6.5 - 7.7 .357 - .361 Fe Ni Alloy
Al/SiC 160 6.5 - 8.5 .107 - .110 Contact the factory
Al 2 O 3 25 6.9 .143 Contact the factory
GaAs 44 6.5 .193 Contact the factory
AIN 170 4.6 .120 Contact the factory