Solder Seal Lids, also known as Combo Lids, have been a long standard of the semiconductor industry for high reliability and hermetic sealing package. Standard lids are produced with Alloy 42 or Kovar, are plated with nickel and gold, and feature a gold-tin eutectic frame already attached to the lid.
Performance has been improved with the release of Hi-Rel Combo Lids. The technology of the Hi-Rel lids has significantly improved the resistance to corrosion and moisture. Hi-Rel Combo Lids are also made with Alloy 42 or Kovar and a multi-layer plating process is used (Ni/Au/Ni/Au). They also conform to military standard MIL-M-38510. The outer layer of gold is 25 microinches minimum and the sum of both gold layers is 50 microinches minimum. Each of the two nickel layers is 50-350 microinches and the sum of both Ni layers does not exceed 450 microinches.
- Highest quality Kovar or Alloy 42 plated to exceed MilG 45204 type III grade A
- Corrosion Resistance
- Moisture resistance
- Solder preform already attached for ease of assembly Ideal alignment of lid and perform